From PCB design to tested, delivery-ready assemblies.

Requirements and specifications

The design path begins by capturing customer requirements, applicable standards and certifications, acceptance expectations, cost targets, and the functional requirements that guide the board or system.

• Customer and product requirements
• Applicable standards and certification needs
• User-acceptance test planning
• Cost and functional requirements
• Design-readiness review

Circuit architecture and simulation

Work can range from simple transistor and discrete-component circuits to complex systems built around microprocessors. Functional blocks are modelled and analysed before they are committed to a schematic.

• System and functional block diagrams
• Feasibility and interaction analysis
• Computer simulation where appropriate
• Schematics, PCB layout, and production artwork

Component selection and continuity

Design decisions consider electrical performance alongside budget, availability, lead time, supplier continuity, and approved alternatives so the final board is not trapped by avoidable sourcing problems.

• Availability and lead-time review
• Budget and lifecycle considerations
• Catalog engineering and qualified alternatives
• Back-annotation of approved substitutions

Design for manufacturing

DFM feedback helps avoid undersized parts, unsuitable finishes, unnecessary component count, and assembly choices that increase cost, throughput time, or rework.

• Lean part-count review
• SMT and through-hole trade-offs
• Assembly cost and throughput review
• Testability and rework reduction

SMT and fine-pitch assembly

MIS supports dense surface-mount work and a broad range of package styles for high-mix electronics programs.

• 01005 and 0201 component capability
• BGA, micro-BGA, CCGA, CSP, COB, MCM, and MEM packages
• Fine-pitch, high-pin-count, and press-fit connectors
• Flip chip, SOIC, TSSOP, and other surface-mount packages

Through-hole and soldering

Programs can include pin-through-hole preparation and insertion, hand assembly, wave soldering, or selective soldering according to the product and volume.

• Universal through-hole radial, VCD sequencer, and DIP equipment
• Hand assembly for intricate or lower-volume requirements
• Wave and selective soldering
• First-off and in-process inspection

Coating, cleaning, and protection

Assembly capability includes selective conformal coating, aqueous cleaning, lead-free manufacturing support, and controlled handling for sensitive electronics.

• Selective conformal coating
• Aqueous cleaning
• Lead-free process support
• Packaging and moisture protection

ESD controls

Personnel who work in or access ESD-sensitive areas receive awareness and certification training. Protected areas, instructions, drawings, cautions, markings, and access controls are maintained and audited.

• Training before protected-area access
• Documented cautions and handling procedures
• Regular audit and certification of protected areas
• Restricted access for trained personnel

Purchasing and supplier control

The team manages component procurement through proven suppliers and long-standing North American distributor relationships, including support for difficult-to-find and long-lead parts.

• Approved suppliers and components
• Customer approval before a substitution
• No unilateral supplier or part changes
• Long-lead and hard-to-find sourcing support

Receiving, kitting, and inventory

Quality control checks incoming parts before barcode scanning and real-time tracking prepare them for current and scheduled production runs.

• Part-number and date-code checks
• Shipping and electrostatic-damage review
• Visual defect and condition checks
• Barcode and real-time stock tracking

Four SMT lines

MIS operates four complete SMT lines supported by screen printing, high-speed placement, reflow, aqueous cleaning, through-hole equipment, and post-reflow inspection.

• MYDATA MY15E and MY12 placement equipment
• Universal 4796 HSP and 4797L HSP equipment
• EKRA X4 and X5 printers
• Triton IV MIL SMT aqueous cleaner
• Vantage S22 post-reflow AOI and Marantz inspection

Manufacturing engineering and quality

Production support connects DFM, DFT, DFC, first-article review, defect analysis, cost reduction, traceability, and test-fixture planning with the customer program.

• Root-cause and corrective-action support
• X-ray, EDX, ESM, micro-sectioning, ionic chromatography, and related failure-analysis options
• Obsolescence and component batch control
• Dedicated project and configuration management

Lead-free manufacturing

Lead-free assembly support uses an end-to-end approach that considers RoHS expectations, higher process temperatures, narrower process windows, inspection criteria, cleaning implications, and supply-chain coordination.

Five conformal-coating options

Conformal coating can protect boards from moisture and contaminants, shorts and corrosion, dendritic growth and electro-migration, abrasion and solvents, while adding stress relief and insulation resistance.

Cable and harness assembly

Custom cable work is built around customer specifications and tolerances.

• Sophisticated cable and custom harness assemblies
• Multi-conductor applications and chassis wiring
• RF broadband, semi-rigid, semi-flexible, and coaxial cables
• Control panels and varied connector or termination styles

Systems build and integration

Build-to-order and configure-to-order support can connect the boards, backplanes, mechanicals, enclosure, hardware, and software required for a finished system, followed by functional testing and reliability analysis.

BGA rework and reballing

BGA support can include reballing, lifted or missing pad repair, solder-mask repair, component removal, replacement and salvage, X-ray inspection, and circuit-pattern changes at BGA sites.